The TFM201610GHM-R24MTAA is a wire wound chip inductor manufactured by TDK Corporation. It's designed for high-frequency applications, offering a compact size and stable inductance characteristics.

Applications

• Smartphones and other mobile devices
• Wireless communication modules (e.g., Bluetooth, Wi-Fi)
• High-frequency circuits
• Impedance matching
• Noise suppression

Features

• Compact size (2.0 x 1.6 x 1.0 mm)
• Wire-wound construction for high Q factor
• Inductance value of 0.24 µH (0.24 microhenries)
• High self-resonant frequency (SRF)
• Excellent inductance stability over temperature
• Surface-mount technology (SMT) for automated assembly

Benefits

• Enables miniaturization of electronic devices
• Provides stable performance in high-frequency applications
• Reduces noise and interference
• Optimizes impedance matching in RF circuits
• Suitable for high-volume manufacturing

Additional Details

The TFM201610GHM-R24MTAA inductor features a small footprint, making it ideal for space-constrained applications. Its wire-wound construction contributes to a high Q factor, which is essential for efficient energy storage and minimal signal loss in high-frequency circuits. The inductance value of 0.24 µH is specifically chosen for applications requiring precise impedance matching or filtering at particular frequencies. The high self-resonant frequency (SRF) ensures that the inductor behaves predictably within the intended operating range. This component is frequently used in RF amplifiers, filters, and oscillators to optimize performance and minimize unwanted noise. Its surface-mount design allows for efficient and cost-effective assembly using automated equipment. The TFM201610GHM-R24MTAA is designed to withstand reflow soldering temperatures, ensuring reliable connections to the printed circuit board. Its robust construction and stable performance make it a suitable choice for demanding applications in mobile and wireless devices.