The SSQ-123-03-G-D is a Tiger Beam™ socket strip manufactured by Samtec. This is a high-density interconnect designed for board-to-board applications where space is limited and reliable signal transmission is crucial. The part number specifies a 23-position, double-row socket strip with a 0.635mm pitch and gold plating.

Applications

• High-Density Board-to-Board Connections: Ideal for applications requiring a large number of signals to be transmitted between boards in a compact space.
• Networking Equipment: Used in switches, routers, and other networking devices for interconnecting various modules.
• Telecommunications Systems: Employed in telecom infrastructure for reliable connections in densely packed systems.
• Industrial Control Systems: Suitable for use in industrial automation and control equipment where robust and reliable connections are necessary.
• Medical Devices: Used in medical equipment where signal integrity and reliability are critical.

Features

• 0.635mm Pitch: Offers a high-density interconnect solution, maximizing board space utilization.
• Double Row: Provides a greater number of contacts in a smaller footprint compared to single-row connectors.
• 23 Positions: Accommodates a specific number of signal connections based on the application requirements.
• Tiger Beam™ Contacts: Samtec's Tiger Beam™ contact system ensures a reliable and secure connection with high withdrawal forces.
• Gold Plating: Provides excellent conductivity and corrosion resistance for long-term reliability.
• Surface Mount Technology (SMT): Designed for easy and efficient surface mount soldering onto the PCB.

Benefits

• Increased Board Density: The fine pitch and double-row design allow for a higher density of connections in a smaller area, optimizing board space.
• Reliable Signal Transmission: The Tiger Beam™ contact system ensures a stable and secure connection, minimizing signal loss and maintaining signal integrity.
• Improved System Performance: By reducing signal degradation, this connector contributes to the overall performance and reliability of the system.
• Corrosion Resistance: Gold plating provides excellent protection against corrosion, ensuring long-term reliability in harsh environments.
• Simplified Assembly: Surface mount design simplifies the assembly process and reduces manufacturing costs.

Additional Details

The SSQ-123-03-G-D typically features a black insulator material. The contact material is usually a beryllium copper alloy with gold plating over nickel. It is designed for reflow soldering processes. Current rating, voltage rating, and operating temperature ranges depend on the specific application and should be verified in the datasheet.