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SFM-102-01-L-D-A

Part No SFM-102-01-L-D-A
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Description CONN RCPT 4POS 0.05 GOLD PCB / 4 Position Receptacle Connector 0.050" (1.27mm) Through Hole Gold
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr Samtec Inc.
Series Tiger Eye™ SFM
Package Tube
Connector Type Receptacle
Contact Type Female Socket
Style Board to Board or Cable
Number of Positions 4
Number of Positions Loaded All
Pitch - Mating 0.050" (1.27mm)
Number of Rows 2
Row Spacing - Mating 0.050" (1.27mm)
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Insulation Color Black
Insulation Height 0.180" (4.57mm)
Contact Length - Post 0.120" (3.05mm)
Temperature Range - Operating -55°C ~ 125°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Mated Stacking Heights 6.02mm, 6.17mm, 7.80mm, 7.95mm, 9.58mm, 9.73mm, 11.48mm, 11.63mm
Features Board Guide
Current Rating (Amps) 3.2A per Contact
Voltage Rating 250VAC
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Beryllium Copper
Base Product Number SFM-102
MSL Level Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 89
Win Source Part Number 1160939-SFM-102-01-L-D-A
Ultra Librarian 3D Model Ultra Librarian SFM-102-01-L-D-A CAD Model

Description

The SFM-102-01-L-D-A is a high-quality, 2.54 mm (.100") pitch surface mount female connector strip manufactured by Samtec Inc. It is part of the SFM series, known for its reliability and versatility in various board-to-board applications. This connector is designed to provide a secure and robust connection between two printed circuit boards (PCBs). The SFM-102-01-L-D-A is commonly used in applications requiring a low-profile, high-density interconnect solution.

Applications:

  • Board-to-Board Connections: Used to establish electrical connections between two PCBs in a wide range of electronic devices.
  • Medical Equipment: Employed in medical devices where reliable and compact connections are crucial.
  • Industrial Automation: Utilized in industrial control systems for connecting various modules and sensors.
  • Consumer Electronics: Found in various consumer electronic devices, such as digital cameras, smartphones, and audio equipment.
  • Test and Measurement Equipment: Used in test and measurement devices for signal routing and connectivity.

Features:

  • 2.54 mm (.100") Pitch: Standard pitch allows for easy integration with other components and PCBs.
  • Surface Mount Design: Designed for surface mount soldering, enabling automated assembly and reduced manufacturing costs.
  • Dual Row: Features a dual-row configuration for increased contact density and signal integrity.
  • 2 Positions: This connector has 2 positions (or pins) per row, so 4 total.
  • Gold Plating: Gold plating on the contacts ensures excellent conductivity and corrosion resistance.
  • Low Profile: Low profile design for space-constrained applications.

Benefits:

  • Reliable Connection: Provides a secure and reliable connection between PCBs, ensuring stable signal transmission.
  • High Density: Offers a high-density interconnect solution, maximizing the number of connections in a small area.
  • Automated Assembly: Surface mount design facilitates automated assembly, reducing manufacturing time and costs.
  • Long-Term Durability: Gold plating on the contacts ensures long-term durability and resistance to corrosion.
  • Versatile Application: Suitable for a wide range of applications due to its compact size and reliable performance.

The SFM-102-01-L-D-A connector is typically made of high-temperature thermoplastic material, which is suitable for reflow soldering processes. The contacts are made of beryllium copper or phosphor bronze with gold plating over nickel. The connector is designed to meet industry standards for RoHS compliance and is available in various packaging options for automated assembly processes.

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