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Same model may have multiple batches, images only for reference.
ESW-114-59-S-D
Same model may have multiple batches, images only for reference.

ESW-114-59-S-D

Part No ESW-114-59-S-D
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Description CONN SOCKET 28POS 0.1 GOLD PCB / 28 Position Elevated Socket Connector 0.100" (2.54mm) Through Hole Gold
Datasheet
ESW-114-59-S-D Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr Samtec Inc.
Series ESW
Package Tube
Connector Type Elevated Socket
Contact Type Forked
Style Board to Board
Number of Positions 28
Number of Positions Loaded All
Pitch - Mating 0.100" (2.54mm)
Number of Rows 2
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Insulation Color Black
Insulation Height 0.635" (16.13mm)
Contact Length - Post 0.280" (7.11mm)
Temperature Range - Operating -55°C ~ 125°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Current Rating (Amps) 5.2A per Contact
Voltage Rating 550VAC
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Base Product Number ESW-114
MSL Level Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
Win Source Part Number 1104330-ESW-114-59-S-D
Ultra Librarian 3D Model Ultra Librarian ESW-114-59-S-D CAD Model

Description

The ESW series elevated socket connector from Samtec Inc. has a forked contact and is terminated by soldering.

  • Positions Loaded: 28
  • Number of Rows: 2
  • Pitch: 0.100” (2.54mm)
  • Voltage Rating: 550VAC
  • Insulation Material: Liquid crystal polymer (LCP)
  • Contact Finish Mating: Gold
  • Contact Finish Thickness Mating: 30.0µin (0.76µm)
  • Contact Finish Post: Tin
  • Operating Temperature: -55°C to 125°C
  • Packaging: Tube
  • Current Rating per Contact: 5.2A
  • Application: Board-to-board

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