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APA-308-G-N

Part No APA-308-G-N
Manufacturer Samtec Inc.
Catalog Sockets for ICs, Transistors
Description ADAPTER PLUG / 8 (2 x 4) Pos Socket Gold Through Hole
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Sockets for ICs, Transistors
Mfr Samtec Inc.
Series APA
Package Tube
Number of Positions or Pins (Grid) 8 (2 x 4)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 20.0µin (0.51µm)
Contact Material - Mating Phosphor Bronze
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 20.0µin (0.51µm)
Contact Material - Post Phosphor Bronze
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating UL94 V-0
Base Product Number APA-308
MSL Level Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 57
Win Source Part Number 1045324-APA-308-G-N
Ultra Librarian 3D Model Ultra Librarian APA-308-G-N CAD Model

Description

The APA series open frame socket for ICs and transistors is an ideal solution for your interconnect needs.

  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Material Flammability Rating: UL94 V-0
  • Positions/Pins (Grid): 8
  • Pitch: 0.100" (2.54mm)
  • Contact Finish Thickness: 20.0µin (0.51µm)
  • Contact Material: Phosphor Bronze
  • Termination: Through Hole
  • Temperature Range: -55°C to 125°C
  • Standard Package: 57 units
  • Alternative Parts (Cross-Reference): 5103309-1, 5103308-2, 5103309-5, 90130-1210, 02-08-2004, and 70246-1001
  • MSL Level: Not Applicable
  • HTSUS: 8536.69.4040
  • Manufacturer: Samtec Inc.

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