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CL21A476MQYNYNF

Part No CL21A476MQYNYNF
Manufacturer Samsung
Catalog Miscellaneous
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Categories Uncategorized
Manufacturer Samsung
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 820528-CL21A476MQYNYNF
Ultra Librarian 3D Model Ultra Librarian CL21A476MQYNYNF CAD Model

Description

The CL21A476MQYNYNF is a multilayer ceramic capacitor (MLCC) from Samsung Electro-Mechanics. MLCCs are widely used in electronic circuits for various purposes, including decoupling, bypassing, filtering, and energy storage. The CL21 series is known for its compact size and high capacitance value.

Applications

  • Mobile Phones
  • Tablet Computers
  • Laptop Computers
  • Wearable Electronics
  • Power Supplies
  • Consumer Electronics

Features

  • High Capacitance: 47µF
  • Voltage Rating: 25V
  • Case Size: 0805 (2.0mm x 1.25mm)
  • Temperature Coefficient: X5R (-55°C to +85°C, ±15%)
  • RoHS Compliant
  • High Reliability

Benefits

  • Effective Decoupling: Provides a stable power supply by suppressing voltage fluctuations.
  • Noise Filtering: Reduces unwanted noise and interference in electronic circuits.
  • Compact Design: Saves board space in space-constrained applications.
  • Stable Performance: Maintains stable capacitance over a wide temperature range.
  • Long Lifespan: Offers high reliability and long-term stability.

Technical Specifications

The CL21A476MQYNYNF boasts a capacitance of 47 microfarads (µF) with a tolerance of ±20%. Its voltage rating is 25 volts. The X5R temperature coefficient ensures that the capacitance remains relatively stable between -55°C and +85°C. The 0805 case size is a standard size for surface-mount components, allowing for easy integration into automated assembly processes. It is designed for reflow soldering. The component is lead-free and RoHS compliant, ensuring environmental friendliness.

This capacitor is commonly used in power rails of digital circuits for decoupling purposes. The large capacitance value helps to smooth out voltage dips and spikes, preventing malfunctions or damage to sensitive components. Its compact size allows it to be placed close to the IC being decoupled, which minimizes the inductance of the connection and maximizes the effectiveness of the decoupling.

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