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UPD70F3633GJA-GAE-QS-AX

Part No UPD70F3633GJA-GAE-QS-AX
Manufacturer Renesas Electronics America
Catalog Embedded - Microcontrollers
Description IC MCU 32BIT SMD / series Microcontroller IC
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr Renesas Electronics America Inc
Package Tray
Product Status Obsolete
MSL Level 3 (168 Hours)
ECCN OBSOLETE
HTSUS 0000.00.0000
Standard Package 1
Win Source Part Number 1102966-UPD70F3633GJA-GAE-QS-AX
Ultra Librarian 3D Model Ultra Librarian UPD70F3633GJA-GAE-QS-AX CAD Model

Description

The UPD70F3633GJA-GAE-QS-AX is a microcontroller unit (MCU) manufactured by Renesas Electronics America. It is part of the UPD70F36 series of microcontrollers, designed for embedded systems requiring a good balance of processing power, memory, and peripheral integration. The suffix 'GJA-GAE-QS-AX' likely specifies the package type, temperature range, and other manufacturing-related characteristics specific to this particular variant. This MCU is suitable for a wide range of applications requiring real-time control, data processing, and communication capabilities.

Applications

  • Industrial Automation: Used in programmable logic controllers (PLCs), motor drives, and other industrial control systems.
  • Automotive Electronics: Employed in body control modules (BCMs), instrument clusters, and other automotive applications.
  • Consumer Electronics: Found in appliances, audio/video equipment, and other consumer devices requiring embedded control.
  • Medical Devices: Used in patient monitoring systems, diagnostic equipment, and other medical applications.

Features

  • High-Performance CPU Core: Provides processing power for real-time control and data manipulation.
  • Integrated Flash Memory: Offers non-volatile storage for program code and data.
  • On-Chip RAM: Enables fast data access and processing.
  • Extensive Peripheral Set: Includes timers, UARTs, SPI, I2C, ADC, DAC, CAN, and other interfaces for communication and control.
  • Low-Power Operation: Minimizes energy consumption for battery-powered and energy-efficient applications.

Benefits

  • Optimized System Performance: Delivers the right balance of processing power and memory for the application.
  • Reduced System Cost: Integrates multiple functions into a single chip.
  • Enhanced System Reliability: Provides robust operation in harsh environments.
  • Simplified System Design: Reduces the number of external components required.
  • Faster Time to Market: Supported by comprehensive development tools and software libraries.

To get the exact specifications, including memory size, clock speed, peripheral configurations, and package details, consult the official Renesas documentation for the UPD70F36 family and the specific UPD70F3633GJA-GAE-QS-AX part number.

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