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UPD70F3371M2GBA1-GAH-AX

Part No UPD70F3371M2GBA1-GAH-AX
Manufacturer Renesas Electronics America
Catalog Embedded - Microcontrollers
Description RISC MICROCONTROLLER, 32 BIT, FL
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - Microcontrollers
Mfr Renesas Electronics America
Series V850ES/FE3
Package Bulk
Product Status Active
Programmable Not Verified
Core Processor V850ES
Core Size 32-Bit Single-Core
Speed 32MHz
Connectivity CANbus, CSI, I²C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT
Number of I/O 51
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size 32K x 8
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 3.3V ~ 5.5V
Data Converters A/D 10x10b
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 110°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
Supplier Device Package 64-LFQFP (10x10)
Base Product Number UPD70F3371
Standard Package 1 pcs
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
HTSUS 0000.00.0000
Win Source Part Number 902175-UPD70F3371M2GBA1-GAH-AX
Ultra Librarian 3D Model Ultra Librarian UPD70F3371M2GBA1-GAH-AX CAD Model

Description

The 902175-UPD70F3371M2GBA1-GAH-AX, is an embedded integrated circuit V850ES/FE3 microcontroller suitable for various applications from Renesas Electronics America.

  • Core Processor: 32-bit single-core V850ES
  • Speed: 32MHz
  • Connectivity: CANbus, CSI, I²C, LINbus, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Program Memory Size: 256KB
  • EEPROM Size: 32K x 8
  • Package Type: 64-LQFP
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C to 110°C
  • Product Status: Active
  • REACH Status: Unaffected

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