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QS74FCT2374CTSO

Part No QS74FCT2374CTSO
Manufacturer Renesas Electronics America
Catalog OEM Parts (O - R)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Mounting SMD (SMT)
Case / Package SOIC
Maximum Operating Temperature 85 °C
Max Supply Voltage 5.25 V
Min Operating Temperature -40 °C
Min Supply Voltage 4.75 V
Mount Surface Mount
Number of Bits 8
Number of Pins 20
Operating Supply Voltage 5 V
Propagation Delay 5.2 ns
RoHS Non-Compliant
Win Source Part Number 1086916-QS74FCT2374CTSO
Categories OEM Parts(O-R)
Manufacturer Renesas Electronics America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian QS74FCT2374CTSO CAD Model

Description

The QS74FCT2374CTSO is an octal D-type flip-flop with 3-state outputs manufactured by Renesas Electronics America. Belonging to the Fast CMOS Technology (FCT) family, it combines high-speed operation with low power consumption. The '2374' typically indicates an octal D-type flip-flop with edge-triggered inputs and 3-state outputs, making it suitable for a wide range of storage and buffering applications.

Applications

  • Data Buffering: Used to buffer and store data in digital systems.
  • Register Storage: Employed as registers for storing data values.
  • Address Latching: Latches address lines for memory access.
  • I/O Port Expansion: Expands the number of available I/O ports.
  • Control Signal Storage: Stores control signals for various system functions.

Features

  • High-Speed Operation: Offers fast clock-to-output delays for high-performance applications.
  • Low Power Consumption: Achieves low power dissipation through CMOS technology.
  • Edge-Triggered D-Type Flip-Flops: Data is captured on the rising or falling edge of the clock signal.
  • 3-State Outputs: Allows outputs to be in a high, low, or high-impedance state, facilitating bus sharing.
  • SOIC Package: Available in a SOIC (Small Outline Integrated Circuit) package for surface-mount applications.

Benefits

  • Improved System Performance: High-speed operation contributes to faster overall system performance.
  • Reduced Power Consumption: Low power consumption saves energy and reduces heat generation.
  • Precise Data Storage: Edge-triggered inputs ensure accurate data capture.
  • Design Flexibility: 3-state outputs enable versatile bus-oriented designs.
  • Compact Footprint: SOIC package minimizes board space requirements.

Additional Details

The device operates from a supply voltage of typically 5V. Key parameters include clock-to-output delay, setup and hold times, and power dissipation characteristics. The 'CT' designation indicates a specific temperature range or speed grade. Detailed electrical characteristics, timing diagrams, and package dimensions are available in the Renesas datasheet. The output enable pin controls the 3-state outputs.

Designers should always refer to the official datasheet for precise specifications and application guidelines. The SOIC package is well-suited for automated assembly processes.

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