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HYB18T512400CF-3S

Part No HYB18T512400CF-3S
Manufacturer Qimonda
Catalog DDR
Description DDR2-667 128Mx4
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 942095-HYB18T512400CF-3S
Series *
Ultra Librarian 3D Model Ultra Librarian HYB18T512400CF-3S CAD Model

Description

The HYB18T512400CF-3S is a 512Mb DDR2 SDRAM memory chip manufactured by Qimonda. It provides high-speed and reliable memory performance for various applications.

Applications

  • Desktop PCs
  • Laptop Computers
  • Graphics Cards
  • Gaming Consoles
  • Servers

Features

  • Capacity: 512Mb (64M x 8)
  • DDR2 Interface: Double Data Rate 2 Synchronous DRAM
  • Data Transfer Rate: Up to 800 Mbps
  • Operating Voltage: 1.8V
  • Package: FBGA (Fine-pitch Ball Grid Array)
  • JEDEC Standard Compliant
  • Lead-Free Construction

Benefits

  • High Bandwidth: DDR2 technology offers a significant increase in bandwidth compared to DDR, which improves overall system performance.
  • Low Power Consumption: Operates at 1.8V, reducing power consumption and heat generation, making it suitable for energy-efficient systems.
  • Increased System Responsiveness: Fast data transfer rates lead to faster application loading and smoother multitasking.
  • Reliable Operation: Designed to meet JEDEC standards, ensuring compatibility and reliable performance in various operating conditions.
  • Compact Form Factor: The FBGA package allows for efficient use of space on printed circuit boards.

Additional Details

The HYB18T512400CF-3S utilizes a 4n-prefetch architecture, enabling high-speed data access and improved memory throughput. It also incorporates on-die termination (ODT) to enhance signal integrity and reduce signal reflections, contributing to stable and reliable operation. This memory chip is suitable for a wide range of applications that demand high memory bandwidth and low power consumption, and it is designed to be compliant with industry standards for environmental protection. The use of an FBGA package ensures excellent thermal performance and allows for high-density mounting.

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