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Categories Integrated Circuits
Manufacturer NXP
Packaging Tube/Rail
Status Obsolete(EOL)
Type Class D
Output Type 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load 88W x 1 @ 6 Ohm; 50W x 2 @ 6 Ohm
Supply Voltage - Operating ±12.5 V to 30 V
Features Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Through Hole
Temperature Range - Operating -40°C to 85°C (TA)
Case / Package DBS23P
Dimension 23-SIP Formed Leads
Win Source Part Number 053099-TDA8922BJ
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian TDA8922BJ CAD Model

Description

Introducing the TDA8922BJ from NXP Semiconductors

The TDA8922BJ is a high-efficiency class-D audio power amplifier in a compact package, designed and manufactured by NXP Semiconductors. This innovative product offers an exceptional audio performance with a high level of integration, making it an ideal choice for a wide range of audio applications including TVs, home theater systems, active speakers, and all-in-one audio systems.

Key Features

  • High output power capability: The TDA8922BJ can deliver up to 2 x 100 W into a 4 Ω load or 2 x 50 W into an 8 Ω load, providing ample power for most audio applications.
  • High efficiency: With its class-D operation, the amplifier achieves efficiencies of over 90%, reducing energy consumption and heat dissipation.
  • Low quiescent current: The device has been optimized for low idle power consumption, contributing to energy savings when in standby mode.
  • Wide supply voltage range: The TDA8922BJ operates over a broad supply voltage range from ±12.5 V to ±30 V, offering flexibility in system design.
  • Excellent sound quality: The amplifier provides a high signal-to-noise ratio (SNR) and low total harmonic distortion (THD), ensuring a clear and accurate audio reproduction.
  • Protection features: It includes various protection mechanisms such as short-circuit protection, thermal protection, and a no-switching protection to prevent damage from abnormal operating conditions.

Package and Integration

The TDA8922BJ is available in a 23-pin DIL-bent-SIL (DBS23P) power package. The package is designed to facilitate easy mounting on a heatsink, which is essential for maintaining optimal performance and longevity. The integration of multiple functions within the chip reduces the need for external components, simplifying the circuit design, and saving on space and cost.

Applications

Due to its versatile nature, the TDA8922BJ can be used in a variety of audio applications. Its robust design and high-quality audio output make it suitable for professional audio systems, as well as consumer electronics where space and power efficiency are critical.

In summary, the TDA8922BJ from NXP Semiconductors is a powerful, efficient, and reliable solution for modern audio amplification needs, offering the perfect blend of performance and ease of use for audio system designers and enthusiasts alike.

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