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SSTUP32866EC/G,518

Part No SSTUP32866EC/G,518
Manufacturer NXP / Nexperia
Catalog Logic - Specialty Logic
Description IC REG BUFFER CONFIG 96LFBGA / 1:1, 1:2 Configurable Registered Buffer with Parity IC 96-LFBGA (13.5x5.5)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Logic - Specialty Logic
Mfr NXP USA Inc.
Package Tape & Reel (TR)
Product Status Obsolete
Supply Voltage 1.7V ~ 2V
Number of Bits 25, 14
Temperature Range - Operating 0°C ~ 70°C
Mounting SMD (SMT)
Package / Case 96-LFBGA
Supplier Device Package 96-LFBGA (13.5x5.5)
Base Product Number SSTUP3
Other Names 935281392518,SSTUP32866EC/G-T,SSTUP32866EC/G-T
Standard Package 3,500
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Win Source Part Number 1256357-SSTUP32866EC/G,518
Ultra Librarian 3D Model Ultra Librarian SSTUP32866EC/G,518 CAD Model

Description

The SSTUP32866EC/G,518 is a high-performance, registered clock driver (RCD) from NXP Semiconductors, designed to meet the demanding needs of the latest server and high-speed computing memory interfaces. This advanced product is an integral component in DDR4 memory systems, providing clock distribution and signal conditioning to enhance system reliability, signal integrity, and performance.

Key Features

  • Compatibility: Specifically engineered for DDR4 SDRAM memory systems, the SSTUP32866EC/G,518 ensures seamless integration with the latest high-speed memory technologies.
  • Performance: With its ability to distribute clocks with minimal skew and jitter, this RCD ensures that memory operations are synchronized accurately, enhancing overall system performance.
  • Signal Integrity: The device includes advanced signal conditioning features that help to maintain signal integrity even in environments with high electrical noise, thereby reducing error rates and improving data throughput.
  • Power Efficiency: Designed with power efficiency in mind, the SSTUP32866EC/G,518 operates with a low voltage supply, reducing power consumption for energy-conscious applications.
  • Package: This product is available in a fine-pitch ball grid array (FBGA) package, which is designed for space-saving on PCBs and allows for efficient heat dissipation.

Applications

The SSTUP32866EC/G,518 is ideal for a range of applications that require high-performance memory interfaces, including:

  • Enterprise servers and data centers
  • High-performance computing (HPC) systems
  • Networking and telecommunications equipment
  • Cloud computing infrastructure

Technical Specifications

Below are some of the technical specifications of the SSTUP32866EC/G,518:

  • Supply Voltage (VDD): 1.2V typical
  • Operating Temperature Range: 0°C to 85°C
  • Package: 96-ball FBGA
  • Compliance: Meets or exceeds JEDEC standard requirements for DDR4 RCDs

For designers and engineers looking to build cutting-edge memory interfaces, the SSTUP32866EC/G,518 from NXP Semiconductors offers a blend of performance, power efficiency, and reliability, making it a top choice for next-generation DDR4 memory solutions.

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