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SPC5517SBMLQ66

Part No SPC5517SBMLQ66
Manufacturer NXP / Nexperia
Catalog Embedded - Microcontrollers
Description IC MCU 32BIT 1.5MB FLASH 144LQFP
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer NXP USA Inc.
Packaging Tray
Core Processor e200z1
Core Size 32-Bit
Speed 66MHz
Connectivity CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 111
Program Memory Size 1.5MB (1.5M x 8)
Program Memory Type FLASH
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.25V
Data Converters A/D 40x12b
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 125°C
Mounting Style SMD
Manufacturer Package 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Part Number Series SPC5517
Manufacturer Pack Quantity 60
MSL Level 3 (168 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 814138-SPC5517SBMLQ66
Ultra Librarian 3D Model Ultra Librarian SPC5517SBMLQ66 CAD Model

Description

The NXP SPC5517SBMLQ66 microcontroller is a powerful and versatile integrated circuit designed for automotive and industrial applications requiring high levels of performance, reliability, and efficiency. This microcontroller is part of NXP's SPC5 family, which is well-known for its robust architecture and state-of-the-art features tailored to meet the stringent requirements of the automotive industry.

Key Features

  • Core: The SPC5517SBMLQ66 is built around a 32-bit Power Architecture core, providing a solid foundation for applications that require high-speed processing and real-time performance.
  • Memory: It comes equipped with a generous memory capacity, including 1.5MB of flash memory for program storage and 64KB of RAM for data processing, ensuring smooth operation and ample space for complex software applications.
  • Operating Frequency: The microcontroller operates at a frequency of up to 66MHz, delivering the computational power needed for demanding applications.
  • Temperature Range: With an operational temperature range of -40°C to 125°C, it can withstand extreme environmental conditions, making it suitable for under-the-hood applications.
  • Communication Interfaces: Multiple communication interfaces are available, including CAN, LIN, and SPI, providing versatile connectivity options for various peripherals and devices.
  • Package: The device is packaged in a LQFP-144 (20x20) form factor, which is ideal for space-constrained applications while still offering sufficient I/O pins for complex tasks.

Applications

The SPC5517SBMLQ66 is designed to handle a wide range of applications within the automotive sector, including engine management systems, transmission control units, body control modules, and advanced driver-assistance systems (ADAS). Its robust design also makes it suitable for industrial control systems where precision and reliability are critical.

Quality and Support

NXP is committed to delivering high-quality products with comprehensive technical support. The SPC5517SBMLQ66 microcontroller is backed by NXP's extensive documentation, development tools, and software libraries, which help streamline the development process and reduce time-to-market for engineers and developers.

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Pricing & Ordering

Quantity Unit Price Ext. Price
3+ $17.2664 $51.7992
8+ $14.1673 $113.3384
11+ $13.7245 $150.9695
16+ $13.2818 $212.5088
20+ $12.8391 $256.7820
27+ $11.5109 $310.7943
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Prices are subject to market and will be confirmed after the order is placed.
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Availability: 20 pieces
MOQ: 3 pcs
Order Increment : 1 pcs
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