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MC33889BDW

Part No MC33889BDW
Manufacturer NXP / Nexperia
Catalog Interface - Specialized
Description System Basis Chip with Low  Speed Fault Tolerant CAN  Interface | IC SYSTEM BASE W/CAN 28-SOIC
Sample
Rohs State Need to verify
ECAD Module
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Categories Integrated Circuits
Manufacturer NXP
Packaging Tube
Status Obsolete
Applications Automotive
Interface CAN
Supply Voltage (V) 5.5V ~ 18V
Manufacturer Package 28-SOIC
Supplier Device Package 28-SOIC
Mounting Style SMD
Family Part Number MC33889
Manufacturer Pack Quantity 1
MSL Level 1 (Unlimited)
Win Source Part Number 1218510-MC33889BDW
Manufacturer Homepage www.freescale.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian MC33889BDW CAD Model

Description

The MC33889BDW from NXP Semiconductors is a powerful and versatile System Basis Chip (SBC) designed to support the demanding requirements of automotive applications. This integrated circuit provides a robust interface between the microcontroller and the physical layer of the Controller Area Network (CAN), making it an essential component for in-vehicle networking.

Key Features

  • High-Speed CAN Interface: The MC33889BDW includes a high-speed CAN transceiver that complies with the ISO 11898 standard, ensuring reliable communication at data rates up to 1 Mbps.
  • Voltage Regulator: An integrated voltage regulator provides a stable supply voltage for the microcontroller and other peripherals, with various options for standby and low-power modes to enhance energy efficiency.
  • Multiple Wake-Up Inputs: Multiple wake-up inputs are available, enabling the device to be brought out of low-power mode through various stimuli, such as key ignition or bus activity.
  • Watchdog Timer: A built-in watchdog timer helps to ensure system reliability by monitoring the microcontroller and resetting it in the event of a malfunction.

Applications

The MC33889BDW is ideal for a range of automotive applications, including:

  • Body Control Modules
  • Gateway Modules
  • Powertrain Systems
  • Chassis Control Units

Quality and Reliability

As with all NXP products, the MC33889BDW is manufactured to the highest quality standards, ensuring exceptional reliability for automotive environments. It is designed to withstand the harsh conditions typical in automotive applications, including wide temperature ranges and electrical transients.

Package and Availability

The device comes in a 20-SOIC wide body package, making it suitable for space-constrained applications. It is available for order and can be sourced directly from NXP or through their authorized distributors.

For detailed technical specifications, application notes, and support resources, please refer to the official NXP Semiconductors website or contact their customer support team.

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