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Same model may have multiple batches, images only for reference.
UPD78328CW-078 NEC
Same model may have multiple batches, images only for reference.

UPD78328CW-078

Part No UPD78328CW-078
Manufacturer NEC
Catalog HOT - SALES and EOL Components (U - Z)
Sample
Rohs State Need to verify
ECAD Module
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Manufacturer NEC
Win Source Part Number 394704-UPD78328CW-078
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian UPD78328CW-078 CAD Model

Description

The UPD78328CW-078 is a microcontroller manufactured by NEC (now Renesas Electronics) and belongs to the 78K/III series. These microcontrollers are designed for embedded systems that require a combination of processing power and energy efficiency.
  • Utilized in devices such as remote controls, toys, and small home appliances.
  • Employed in applications like motor control, sensor data acquisition, and industrial automation setups.
  • Found in various automotive electronic systems, including lighting control and dashboard instrumentation.
  • Integrated into devices like printers, scanners, and other office automation peripherals.
  • Features a 78K/III series CPU core, offering efficient processing.
  • Includes on-chip ROM and RAM for program code and data storage. Memory sizes depend on the specific configuration.
  • Provides a wide range of programmable I/O ports for interfacing with external devices and sensors.
  • Incorporates several timers and counters for timing control, event counting, and pulse generation.
  • Supports serial communication interfaces, including UART, SPI, and I2C.
  • May feature an Analog-to-Digital converter for converting analog signals into digital data.
  • Includes an integrated interrupt controller to manage real-time events efficiently.
  • Offers a good balance between processing power and low-power operation.
  • Provides multiple communication interfaces for seamless integration with other systems.
  • Represents a cost-effective option for diverse embedded control applications.
  • Available in compact packages, reducing board space requirements.

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