The 87833-1419 is a Micro-Fit 3.0 Header from Molex. Specifically, it is a 14-circuit, single-row, vertical header, designed for creating reliable board-to-wire connections in a multitude of electronic devices.

Applications:

• Power supplies
• Industrial controls
• Automotive systems
• Consumer appliances
• Telecommunication devices

Features:

• Vertical mounting style
• Single row
• 14 circuits
• 3.0mm pitch
• Durable high-temperature thermoplastic construction

Benefits:

• Offers dependable and secure wire-to-board connections.
• Provides a compact solution where space is limited.
• Simplifies assembly and maintenance procedures.
• Ensures prolonged operational life and resilience in demanding environments.
• Complies with relevant industry regulations for safety and performance.

Additional Details:

The 87833-1419 connector is generally constructed from high-temperature thermoplastic, making it suitable for reflow soldering processes. It's designed to be compatible with Molex's Micro-Fit 3.0 receptacle connectors. Key parameters to consider include the voltage and current ratings, as well as the operational temperature range. The 3.0mm pitch enables dense connections while maintaining reliable electrical contact. Consult the Molex product datasheet for detailed specifications, including mating connector details and recommended PCB layout, to guarantee proper assembly and performance within the application.