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110-13-314-10-002000

Part No 110-13-314-10-002000
Manufacturer Mill-Max Manufacturing Corp.
Catalog Sockets for ICs, Transistors
Description CONN IC DIP SOCKET 14POS GOLD / 14 (2 x 7), 8 Loaded Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Sockets for ICs, Transistors
Mfr Mill-Max Manufacturing Corp.
Series 110
Package Tube
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 14 (2 x 7), 8 Loaded
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 30.0µin (0.76µm)
Contact Material - Post Brass Alloy
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Temperature Range - Operating -55°C ~ 125°C
Termination Post Length 0.125" (3.18mm)
Current Rating (Amps) 3 A
Base Product Number 110-13
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Other Names 11013-31410002000,1101331410002000
Standard Package 28
Win Source Part Number 1033581-110-13-314-10-002000
Ultra Librarian 3D Model Ultra Librarian 110-13-314-10-002000 CAD Model

Description

The Mill-Max Manufacturing Corp. 1033581-110-13-314-10-002000 electronic component is a DIP type socket for ICs and transistors.

  • Type: DIP Socket
  • Row Spacing: 0.3"
  • Design: Open Frame
  • Positions/Pins (Grid): 14
  • Loaded Pins: 8
  • Pitch-Mating: 0.100"
  • Contact Finish: Gold
  • Contact Finish Thickness: 30.0µin
  • Contact Material: Beryllium Copper
  • Current Rating: 3A
  • Operating Temperature Range: -55°C to 125°C

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