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MT47H128M8HQ-37:E

Part No MT47H128M8HQ-37:E
Manufacturer Micron Technology Inc.
Catalog DDR
Description DDR2-533 128Mx8 Pb-Free
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Series *
Win Source Part Number 942138-MT47H128M8HQ-37:E
Ultra Librarian 3D Model Ultra Librarian MT47H128M8HQ-37:E CAD Model

Description

The MT47H128M8HQ-37:E is a DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) component manufactured by Micron Technology Inc. This memory chip is designed to provide high-speed data access for a variety of applications requiring substantial memory bandwidth. It is commonly used in computing and embedded systems.

Applications

  • Desktop PCs
  • Laptop Computers
  • Graphics Cards
  • Embedded Systems
  • Networking Devices

Features

  • Capacity: 128 Meg x 8 bits
  • Data Rate: DDR2, enabling faster data transfer rates compared to standard DDR SDRAM.
  • Clock Frequency: The -37 speed grade determines the operating clock frequency.
  • Voltage: Operates at 1.8V, optimizing power consumption.
  • Interface: DDR2 interface for broad compatibility.
  • Package: FBGA (Fine-pitch Ball Grid Array) for efficient board assembly.

Benefits

  • Enhanced Bandwidth: Provides improved bandwidth over DDR, resulting in faster data processing.
  • Reduced Power Consumption: Operates at a lower voltage, reducing power consumption.
  • Improved System Performance: Enables faster loading, smoother multitasking, and overall improved system responsiveness.
  • Reliable Performance: Manufactured by Micron, ensuring high reliability.
  • Broad Compatibility: Designed to be compatible with systems supporting DDR2 memory.

Additional Details

The MT47H128M8HQ-37:E complies with JEDEC standards for DDR2 SDRAM, ensuring interoperability. It includes features like on-chip termination (ODT) for signal integrity. Power-saving modes are also incorporated to minimize power consumption during idle periods. The -37 speed grade specifies the maximum supported clock frequency and access time. Ensure that the memory speed is compatible with the system’s memory controller. The FBGA package facilitates heat dissipation and high-density board layouts.

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