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MSC030SDA330B

Part No MSC030SDA330B
Manufacturer Microchip Technology
Catalog Diodes, Rectifiers - Single
Description DIODE SIL CARB 3.3KV 30A TO247 / Diode 3300 V 30A Through Hole TO-247
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Discrete Semiconductor Products - Diodes - Rectifiers - Single Diodes
Mfr Microchip Technology
Package Bulk
Technology SiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) 3300 V
Current - Average Rectified (Io) 30A
Speed No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr) 0 ns
Mounting Type Through Hole
Package / Case TO-247-2
Supplier Device Package TO-247
Standard Package 1
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.10.0080
Win Source Part Number 1338085-MSC030SDA330B
Ultra Librarian 3D Model Ultra Librarian MSC030SDA330B CAD Model

Description

Microchip Technology's MSC030SDA330B: A High-Performance SiC Power Module

Microchip Technology's MSC030SDA330B is an advanced silicon carbide (SiC) power module designed to deliver exceptional performance and efficiency for a wide range of power applications. This module is part of the Microchip's SiC product family, which is renowned for its ability to handle high temperatures and high voltage operations with ease.

The MSC030SDA330B module is a testament to Microchip's commitment to providing solutions that meet the ever-increasing demands of the power electronics industry. With its robust design, this power module is ideal for applications such as electric vehicles, industrial motor drives, power supply systems, and renewable energy inverters.

Key Features of the MSC030SDA330B:

  • High-Efficiency SiC MOSFETs: The module integrates state-of-the-art silicon carbide MOSFETs, which offer reduced switching losses and improved thermal performance compared to traditional silicon-based MOSFETs.
  • High-Temperature Operation: The MSC030SDA330B can operate at junction temperatures up to 150°C, allowing for higher power density and reliability in harsh environments.
  • Low Inductance Design: The module's low inductance design minimizes switching losses and improves electromagnetic compatibility (EMC).
  • Easy Integration: With its industry-standard package, the MSC030SDA330B ensures easy integration into existing designs, reducing time to market for new products.
  • Optimized for Fast Switching: The module is optimized for fast switching applications, which is essential for reducing losses in high-frequency power converters.

The MSC030SDA330B also boasts a high level of durability and reliability, with its rugged construction that can withstand the rigors of demanding applications. Its superior thermal management capabilities ensure that the module operates at optimal efficiency even under high load conditions.

Overall, the MSC030SDA330B from Microchip Technology represents a powerful solution for designers looking to leverage the benefits of SiC technology in their power conversion systems. With its high performance, efficiency, and reliability, this power module stands out as a top choice for those seeking to improve their systems with cutting-edge technology.

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