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BSM200GB120DN2HOSA1

Part No BSM200GB120DN2HOSA1
Manufacturer Infineon Technologies
Catalog IGBTs - Modules
Description IGBT MOD 1200V 290A 1400W
Sample
Rohs State rohs
ECAD Module
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Categories Discrete Semiconductor Products
Features IGBT Module - Half Bridge 1200 V 290 A 1400 W Chassis Mount Module
Manufacturer Infineon Technologies
Package Tray
Part Status Not For New Designs
Operating Temperature Range 150°C (TJ)
Mounting Chassis Mount
Package Module
Case / Package Module
Family Name BSM200
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.29.0095
Other Part Number BSM200GB120DN2, SP000014913
Quantity per package 10
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 864713-BSM200GB120DN2HOSA1
Ultra Librarian 3D Model Ultra Librarian BSM200GB120DN2HOSA1 CAD Model

Description

The BSM200GB120DN2HOSA1 is an IGBT (Insulated Gate Bipolar Transistor) module manufactured by Infineon Technologies. IGBT modules are power semiconductor devices used for switching and controlling high voltages and currents. They combine the advantages of both MOSFETs and bipolar junction transistors, offering high input impedance and low on-state voltage drop. This particular module is designed for use in various high-power applications.

Applications

  • Industrial motor drives: Controlling the speed and torque of electric motors in industrial applications.
  • Uninterruptible power supplies (UPS): Providing backup power in case of a power outage.
  • Welding machines: Controlling the welding current and voltage in welding applications.
  • Renewable energy systems: Converting DC power from solar panels or wind turbines to AC power.
  • Traction drives: Used in electric vehicles and locomotives to control the speed and torque of the traction motors.

Features

  • IGBT Technology: Offers high efficiency and fast switching speeds.
  • Low On-State Voltage Drop: Reduces power losses and improves efficiency.
  • High Blocking Voltage: Capable of withstanding high voltages in the off-state.
  • High Current Capability: Can handle high currents in the on-state.
  • Integrated Gate Driver: Simplifies circuit design and reduces external component count.
  • Isolated Baseplate: Provides electrical isolation between the power terminals and the mounting surface.

Benefits

  • High Efficiency: Reduces power consumption and operating costs.
  • Reliable Performance: Provides stable and reliable operation in demanding applications.
  • Simplified Design: Integrated gate driver simplifies circuit design and reduces component count.
  • Enhanced Safety: Isolated baseplate provides electrical isolation, improving safety.
  • Compact Size: Module design allows for high power density and compact system designs.

Additional Details

The BSM200GB120DN2HOSA1 has specific voltage and current ratings, which must be adhered to for proper operation. The switching frequency affects the efficiency and thermal performance of the module. The thermal resistance determines the heat dissipation capability. The gate drive requirements specify the voltage and current needed to turn the IGBT on and off. The module typically includes built-in protection features such as overcurrent protection and short-circuit protection. Always refer to the official datasheet from Infineon Technologies for detailed specifications and application notes. The datasheet provides information on voltage ratings, current ratings, switching frequency, thermal resistance, gate drive requirements, and protection features. Proper heat sinking and cooling are essential to maintain the IGBT within its safe operating temperature. Carefully follow the manufacturer's recommendations for mounting, cooling, and gate drive circuitry. Consider the appropriate protection schemes to prevent damage due to overcurrent, overvoltage, and short-circuit conditions.

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