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PEEL173P-30

Part No PEEL173P-30
Manufacturer ICT
Catalog HOT - SALES and EOL Components (N - P)
Sample
Rohs State Need to verify
ECAD Module
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Manufacturer ICT
Win Source Part Number 272589-PEEL173P-30
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian PEEL173P-30 CAD Model

Description

The PEEL173P-30 is a Programmable Electrically Erasable Logic (PEEL) device manufactured by ICT. It offers a flexible and cost-effective solution for implementing a wide variety of custom logic functions. This device provides an alternative to traditional TTL logic, allowing designers to integrate multiple logic gates into a single chip, thus reducing board space, component count, and power consumption. The '-30' likely indicates a propagation delay of 30ns.

Applications

  • Address decoding: Used in memory systems to select specific memory locations.
  • Peripheral control: Employed in interfacing microprocessors with peripheral devices like sensors, actuators, and displays.
  • State machines: Implemented for controlling sequential logic operations in digital systems.
  • Glue logic: Acts as an interface between different digital components with incompatible signal levels or timing requirements.
  • Timing control: Used in generating and managing timing signals for various digital circuits.

Features

  • Electrically Erasable: Allows for easy reprogramming and design changes.
  • Programmable Logic: Offers a flexible architecture for implementing various logic functions.
  • Low Power Consumption: Reduces overall system power requirements.
  • High Speed: Operates at speeds suitable for a wide range of applications (30ns propagation delay in this instance).
  • TTL Compatible Inputs/Outputs: Enables seamless integration with other TTL devices.

Benefits

  • Reduced Board Space: Integrates multiple logic functions into a single chip.
  • Simplified Design: Simplifies circuit design and reduces the number of components.
  • Improved Reliability: Reduces the number of interconnections, leading to improved reliability.
  • Lower Power Consumption: Minimizes power consumption compared to discrete logic implementations.
  • Faster Time to Market: Allows for quick prototyping and design changes.

The PEEL173P-30 is typically packaged in a DIP (Dual In-line Package) or PLCC (Plastic Leaded Chip Carrier) for easy insertion into circuit boards. It is programmed using a standard PROM programmer. This device is well-suited for applications requiring moderate speed and flexibility in a cost-effective package.

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Pricing & Ordering

Quantity Unit Price Ext. Price
23+ $2.5988 $59.7724
55+ $2.1321 $117.2655
84+ $2.0651 $173.4684
116+ $1.9993 $231.9188
150+ $1.9323 $289.8450
200+ $1.7325 $346.5000
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 8,000 pieces
MOQ: 23 pcs
Order Increment : 1 pcs
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