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HY57V561620CTP-P

Part No HY57V561620CTP-P
Manufacturer Hynix Semiconductor
Catalog SD
Description SD 16Mx16-P PC100 CL2
Sample
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ECAD Module
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Categories Memory
Win Source Part Number 945148-HY57V561620CTP-P
Series *
Ultra Librarian 3D Model Ultra Librarian HY57V561620CTP-P CAD Model

Description

The HY57V561620CTP-P is a 32Mbit Synchronous DRAM (SDRAM) from Hynix Semiconductor, designed for applications needing fast memory access and moderate storage capacity.

Applications

  • Embedded systems
  • Networking devices (routers, switches)
  • Set-top boxes
  • Printers
  • Industrial control systems

Features

  • Capacity: 32 Mbit (2M x 16)
  • Organization: 2M x 16 bits
  • Synchronous Operation: Operates in synchronization with a clock signal for high-speed data transfers.
  • Burst Mode Operation: Supports sequential data access in burst mode for improved efficiency.
  • LVTTL Compatible Inputs and Outputs: Compatible with standard low-voltage TTL logic levels.
  • Single Power Supply: Typically operates at 3.3V.
  • Package: TSOP (Thin Small Outline Package)

Benefits

  • High Bandwidth: Provides high data transfer rates due to synchronous operation and burst mode.
  • Fast Access Time: Enables quick retrieval and storage of data.
  • Low Power Consumption: Designed for efficient power usage.
  • Compact Size: The TSOP package allows for high-density board designs.
  • Cost-Effective: Provides a good balance of performance and cost for applications requiring 32Mbit.

Additional Details

The HY57V561620CTP-P is a good choice for embedded systems and applications where a 32Mbit memory is sufficient. It provides high speed and moderate capacity in a compact package. The CTP portion of the part number indicates specific package and timing options; the datasheet should be consulted for specific details. Always refer to the Hynix datasheet for precise timing specifications, voltage requirements, and operational guidelines.

This SDRAM requires careful handling to avoid electrostatic discharge (ESD) damage. It is recommended to follow standard ESD precautions when handling and installing this component. Design engineers should consult the datasheet for detailed information on power supply requirements, signal timing, and thermal considerations.

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