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H5UGJHME23X022R

Part No H5UGJHME23X022R
Manufacturer Hynix Semiconductor
Catalog DRAM
Description HBM3 6.40Gb/s 24Gb
Sample
Rohs State Need to verify
ECAD Module
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Category DRAM
Win Source Part Number 1447327-H5UGJHME23X022R
Manufacturer Hynix Semiconductor
Ultra Librarian 3D Model Ultra Librarian H5UGJHME23X022R CAD Model

Description

The H5UGJHME23X022R by Hynix represents a significant leap in High Bandwidth Memory (HBM) technology, a sector crucial for developments in high-performance computing, artificial intelligence, and advanced graphics processing. This model boasts the impressive specification of HBM3 6.40Gb/s 24Gb, spotlighting its exceptional capacity and data transfer rate designed to meet the extremely high-bandwidth requirements of next-generation computing and graphics systems. Such a specification indicates it is poised to significantly impact areas like deep learning, scientific computation, and ultra-high-resolution graphics rendering, where traditional memory bandwidth would be a bottleneck. Hynix's H5UGJHME23X022R underlines the company's commitment to pushing the boundaries of memory technology to cater to ever-growing data processing needs, ensuring devices can rapidly access large volumes of data without hampering performance. Its integration into systems promises to deliver remarkable improvements in speed, efficiency, and the ability to handle complex computations and graphical tasks.

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Shipping Information

Shipped from HK warehouse
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