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H57V2662GTR-75C

Part No H57V2662GTR-75C
Manufacturer Hynix Semiconductor
Catalog SD
Description SD 8Mx32-H 133MHz CL3 Pb-Free
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 945437-H57V2662GTR-75C
Series *
Ultra Librarian 3D Model Ultra Librarian H57V2662GTR-75C CAD Model

Description

The H57V2662GTR-75C is a high-performance Synchronous DRAM (SDRAM) memory chip manufactured by Hynix Semiconductor. It is designed for applications demanding high bandwidth and low latency data access. This SDRAM chip offers a reliable and efficient memory solution for various computing and embedded systems, particularly those requiring a commercial temperature range.

Applications:

  • Graphics Cards: Used as frame buffer memory to render images and videos in desktop and laptop computers.
  • Networking Equipment: Provides high-speed memory for routers, switches, and modems used in office and home networks.
  • Consumer Electronics: Employed in digital TVs, DVD players, and set-top boxes for data storage and processing.
  • Gaming Consoles: Functions as main memory for storing game data and textures in commercial gaming consoles.
  • Printers and Scanners: Used for temporary storage of image data during printing and scanning processes.

Features:

  • 32M x 8 x 4 Banks Configuration: Offers substantial memory capacity and optimized data organization.
  • Double Data Rate (DDR): Transfers data on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate.
  • Clock Rate: Operates at a clock frequency of up to 133 MHz.
  • Low Power Consumption: Minimizes energy consumption, making it suitable for energy-sensitive applications.
  • LVTTL Compatible Inputs and Outputs: Guarantees compatibility with various logic levels, simplifying integration.
  • Self Refresh Mode: Retains data while consuming minimal power in standby mode, conserving energy when not actively in use.

Benefits:

  • High Bandwidth: Facilitates rapid data access and improves overall system performance.
  • Low Latency: Reduces delays in data retrieval, enhancing system responsiveness and user experience.
  • Large Memory Capacity: Provides ample storage space for applications, data, and multimedia content.
  • Energy Efficiency: Minimizes power consumption, contributing to lower energy bills and reduced environmental impact.
  • Reliable Operation: Ensures stable and consistent performance, reducing the likelihood of errors and system crashes.

Additional Details:

The H57V2662GTR-75C is organized as 32M words x 8 bits x 4 banks. It supports double data rate (DDR) operation, which significantly increases the data transfer rate. The chip is designed to operate at a clock frequency of up to 133 MHz. It features LVTTL compatible inputs and outputs, simplifying interfacing with other components in the system. The self-refresh mode allows the memory to retain data while consuming minimal power in standby mode. The -75C indicates a commercial temperature range.

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