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GS8342Q09AE-200

Part No GS8342Q09AE-200
Manufacturer GSI Technology
Catalog OEM Parts (F - I)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Address Bus Width 21 b
Mounting SMD (SMT)
Case / Package FBGA
Density 36 Mb
Maximum Operating Temperature 70 °C
Min Operating Temperature 0 °C
Number of Ports 2
Operating Supply Voltage 1.8 V
Radiation Hardening No
RoHS Compliant
Win Source Part Number 1032239-GS8342Q09AE-200
Categories OEM Parts(F-I)
Manufacturer GSI Technology
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian GS8342Q09AE-200 CAD Model

Description

The GS8342Q09AE-200 is a high-performance synchronous static random-access memory (SRAM) device manufactured by GSI Technology. This SRAM is designed for high-bandwidth applications requiring fast and reliable data access, such as networking, telecommunications, and high-performance computing systems. The '200' likely refers to a speed grade or access time.

Applications

  • Networking Line Cards
  • Telecommunications Equipment
  • High-Performance Computing Systems
  • Data Acquisition Systems
  • Image Processing

Features

  • High-Speed Operation (200 MHz)
  • 36 Megabit Density
  • 3.3V Power Supply
  • QDRII+ or DDRII+ Architecture (consult datasheet for exact type)
  • Burst Mode Operation
  • TTL-Compatible Inputs and Outputs
  • Available in BGA Package

Benefits

  • Increased system performance due to fast data access times and high bandwidth.
  • Improved data throughput in demanding applications.
  • Reduced latency and improved responsiveness.
  • Simplified system integration with TTL-compatible I/O.
  • Compact design due to the BGA package.

Additional Details

The GS8342Q09AE-200 operates on a 3.3V power supply and features a high-speed operation at 200 MHz. It has a 36 Megabit memory density, providing ample storage for various data-intensive applications. The device utilizes either a QDRII+ or DDRII+ architecture (refer to the datasheet for the specific type), enabling high-bandwidth data transfers. It supports burst mode operation, which further enhances data throughput. The TTL-compatible inputs and outputs simplify interfacing with other digital components. It is available in a BGA (Ball Grid Array) package, which offers a compact footprint and improved thermal performance. This SRAM is typically used in networking line cards, telecommunications equipment, and high-performance computing systems where high speed and reliability are critical.

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