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XPC8260ZU200A

Part No XPC8260ZU200A
Manufacturer Freescale Semiconductor - NXP
Catalog OEM Parts (T - Z)
Description MPU MPC82xx RISC 32-Bit 0.29um 200MHz 3.3V 480-Pin TBGA
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RoHS Non-Compliant
Win Source Part Number 1017904-XPC8260ZU200A
Categories OEM Parts(T-Z)
Manufacturer Freescale Semiconductor - NXP
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XPC8260ZU200A CAD Model

Description

The XPC8260ZU200A is a PowerQUICC II family processor from Freescale Semiconductor (now NXP). It's a highly integrated communications processor designed for a variety of networking and telecommunications applications. It combines a powerful CPU core with a rich set of peripheral interfaces to provide a complete system-on-a-chip (SoC) solution.

Applications

  • Networking equipment (routers, switches)
  • Wireless base stations
  • Industrial control systems
  • Telecommunications infrastructure
  • Storage devices (NAS, SAN)
  • Embedded computing platforms.

Features

  • PowerPC core (603e architecture)
  • Integrated memory controller (SDRAM, DDR)
  • Communication Processor Module (CPM) supporting various protocols (Ethernet, ATM, HDLC)
  • Peripheral interfaces (PCI, UART, I2C, SPI)
  • DMA controllers for efficient data transfer
  • Clock generation and management
  • Low power consumption modes.

Benefits

  • High performance for networking and communication tasks
  • Reduced system cost due to high integration
  • Flexible connectivity options with various peripheral interfaces
  • Enhanced reliability with built-in error correction capabilities
  • Simplified software development with comprehensive tool support
  • Enables faster time-to-market for embedded systems.

Additional Details

The XPC8260ZU200A operates at a clock frequency of 200 MHz. It typically supports SDRAM or DDR memory for program execution and data storage. The CPM provides hardware acceleration for common communication protocols, improving overall system performance. It is usually packaged in a BGA (Ball Grid Array) package for high-density board mounting. Software development is commonly done using a dedicated toolchain, including a compiler, debugger, and simulator. Proper heat sinking is necessary to ensure stable operation, especially at high clock frequencies and ambient temperatures. The processor's power consumption should be considered when designing the power supply and thermal management system.

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