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FFPF30UP20DP

Part No FFPF30UP20DP
Manufacturer Fairchild/ON Semiconductor
Catalog Diodes, Rectifiers - Arrays
Description Ultrafast Recovery Power Rectifier
Sample
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ECAD Module
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Manufacturer Fairchild/ON Semiconductor
Win Source Part Number 1174138-FFPF30UP20DP
Manufacturer Homepage www.fairchildsemi.com
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian FFPF30UP20DP CAD Model

Description

The FFPF30UP20DP is an ultrafast recovery rectifier diode array manufactured by Fairchild Semiconductor, now part of ON Semiconductor. This diode array consists of two diodes in a common cathode configuration, designed for high-frequency switching applications requiring fast and efficient rectification.

Applications

  • Power factor correction (PFC)
  • Switch-mode power supplies (SMPS)
  • Freewheeling diodes in inductive loads
  • DC-DC converters
  • Motor drive circuits

Features

  • Ultrafast recovery time (typically 35 ns)
  • High voltage capability (200V)
  • High current capability (30A total, 15A per diode)
  • Low forward voltage drop
  • Common cathode configuration

Benefits

  • Improved efficiency: The ultrafast recovery time minimizes switching losses, leading to improved efficiency in power electronic circuits.
  • Reduced EMI: Fast recovery characteristics reduce electromagnetic interference (EMI) generated during switching.
  • High power density: The high current and voltage ratings allow for compact and high-power designs.
  • Reliable operation: The robust design ensures reliable performance in demanding applications.
  • Simplified circuit design: The common cathode configuration simplifies the design of certain rectifier circuits.

Additional Details

The FFPF30UP20DP features a maximum repetitive reverse voltage (VRRM) of 200V and a forward current (IF) of 15A per diode, totaling 30A for the package. The typical forward voltage drop (VF) is around 0.95V at 15A. The ultrafast recovery time (trr) is typically 35 ns, which is crucial for minimizing switching losses in high-frequency applications.

The device is typically packaged in a TO-220F package, providing good thermal performance. It is commonly used in power supplies for computers, servers, and other electronic equipment, as well as in motor drives and renewable energy systems.

Note: Always refer to the ON Semiconductor datasheet for the most accurate and up-to-date specifications and application information.

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