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BSM100GB170DLC

Part No BSM100GB170DLC
Manufacturer eupec GmbH
Catalog IGBTs - Modules
Description IGBT-Modules
Sample
Rohs State rohs
ECAD Module
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Manufacturer eupec GmbH
Win Source Part Number 1154761-BSM100GB170DLC
Manufacturer Homepage www.eupec.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian BSM100GB170DLC CAD Model

Description

The BSM100GB170DLC is an IGBT module manufactured by eupec GmbH (now Infineon Technologies). It's designed for high-power switching applications, offering a combination of high voltage and current handling capabilities. This module is commonly used in industrial drives, power supplies, and renewable energy systems.

Applications

  • Industrial Motor Drives: Used in variable frequency drives (VFDs) to control the speed and torque of AC motors.
  • Uninterruptible Power Supplies (UPS): Provides reliable power backup in critical applications.
  • Renewable Energy Systems: Implemented in solar inverters and wind turbine converters.
  • Welding Equipment: Used in inverter-based welding machines for precise current control.
  • Traction Drives: Employed in electric vehicles and trains for propulsion control.

Features

  • High Voltage Capability: 1700V blocking voltage for robust performance in high-voltage systems.
  • High Current Handling: 100A continuous collector current for demanding applications.
  • Low Switching Losses: IGBT technology minimizes switching losses, improving efficiency.
  • Isolated Baseplate: Provides electrical isolation between the module and the heatsink.
  • Fast Switching Speed: Enables high-frequency operation and reduces harmonic distortion.

Benefits

  • Improved Efficiency: Low switching losses result in higher energy efficiency and reduced heat dissipation.
  • Enhanced Reliability: Robust design and high voltage capability ensure reliable operation in harsh environments.
  • Simplified Thermal Management: Isolated baseplate simplifies heatsink mounting and thermal management.
  • Reduced System Size: Compact module design allows for smaller and more compact power electronic systems.
  • Cost-Effective Solution: Offers a cost-effective solution for high-power switching applications.

Additional Details

The BSM100GB170DLC features an N-channel IGBT configuration. The module typically requires an external gate driver circuit for optimal performance. The operating temperature range is generally between -40°C and +150°C. Detailed specifications, including switching characteristics, thermal resistance, and gate charge, are available in the datasheet. Proper heatsinking is crucial for maintaining the module within its safe operating area. The module is designed for screw mounting onto a heatsink. It is important to use appropriate thermal interface material between the module and the heatsink to minimize thermal resistance.

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