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Same model may have multiple batches, images only for reference.
S1C17M01F201100
Same model may have multiple batches, images only for reference.

S1C17M01F201100

Part No S1C17M01F201100
Manufacturer Epson Electronics America Inc-Semiconductor Div
Catalog Embedded - Microcontrollers
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr Epson Electronics America Inc-Semiconductor Div
Package Tray
Core Processor S1C17
Core Size 16-Bit
Speed 16.3MHz
Connectivity I2C, IrDA, SPI, UART/USART
Peripherals AMRC, LCD, PWM, RFC, WDT
Number of I/O 19
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 4K x 8
Supply Voltage - Operating 1.8V ~ 5.5V
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting SMD (SMT)
Package / Case 64-TQFP
Supplier Device Package 64-TQFP (10x10)
Base Product Number S1C17M01
Standard Package 160
MSL Level 3 (168 Hours)
ECCN EAR99
HTSUS 8542.31.0001
Win Source Part Number 1264756-S1C17M01F201100
Ultra Librarian 3D Model Ultra Librarian S1C17M01F201100 CAD Model

Description

The Epson Electronics America Inc-Semiconductor Div has designed the S1C17M01F201100, an integrated circuit that is suitable for various applications.

  • Core Size: 16-Bit
  • Program Memory Size: 32KB
  • RAM Size: 4K x 8
  • Connectivity: I2C, IrDA, SPI, and UART/USART
  • Package / Case: 64-TQFP
  • Temperature Range - Operating: -40°C ~ 85°C (TA)

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