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S1C17F57D402000

Part No S1C17F57D402000
Manufacturer Epson Electronics America Inc-Semiconductor Div
Catalog Embedded - Microcontrollers
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr Epson Electronics America Inc-Semiconductor Div
Package Tape & Reel (TR)
Product Status Obsolete
Core Processor S1C17
Core Size 16-Bit
Speed 4.2MHz
Connectivity I2C, IrDA, SPI, UART/USART
Peripherals PWM, WDT
Number of I/O 29
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 2K x 8
Supply Voltage - Operating 2V ~ 3.6V
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting SMD (SMT)
Package / Case Die
Standard Package 500
MSL Level 3 (168 Hours)
ECCN EAR99
HTSUS 8542.31.0001
Win Source Part Number 1264759-S1C17F57D402000
Ultra Librarian 3D Model Ultra Librarian S1C17F57D402000 CAD Model

Description

The Epson Electronics America Inc-Semiconductor Div's S1C17F57D402000 is an integrated circuit that belongs to the S1C17 series.

  • Series: S1C17
  • Core Processor: S1C17
  • Speed: 4.2MHz
  • Applications: Embedded microcontrollers, I²C, IrDA, SPI, UART/USART, PWM, WDT, and more
  • I/O: 29
  • Program Memory Size: 32KB
  • RAM Size: 2K x 8
  • Package/Case: Die
  • Temperature Range: -40°C to 85°C
  • Status: Obsolete

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