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CY7C1320AV18-167BZC

Part No CY7C1320AV18-167BZC
Manufacturer Cypress Semiconductor Corp
Catalog END - OF - LIFE
Description 18-Mbit DDR-II SRAM 2-Word Burst Architecture
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Manufacturer Cypress Semiconductor Corp
Win Source Part Number 1164967-CY7C1320AV18-167BZC
Manufacturer Homepage www.cypress.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian CY7C1320AV18-167BZC CAD Model

Description

The CY7C1320AV18-167BZC is a high-performance synchronous pipelined burst SRAM with a QDR® II+ architecture, manufactured by Cypress Semiconductor. This SRAM is designed for high-bandwidth memory applications requiring fast data transfer rates.

Applications

  • Networking: Used in routers, switches, and network interface cards (NICs) for packet buffering and look-up tables.
  • Communications: Utilized in wireless base stations and other communication equipment for signal processing and data storage.
  • High-performance computing: Employed in servers, workstations, and other high-performance computing systems as cache memory.
  • Test and measurement equipment: Found in oscilloscopes, logic analyzers, and other test equipment for data acquisition and analysis.
  • Image processing: Used in digital cameras, video recorders, and other image processing systems for frame buffering and image enhancement.

Features

  • High bandwidth: QDR II+ architecture enables high-speed data transfer rates up to 167 MHz.
  • Synchronous operation: Operates synchronously with a system clock, ensuring precise timing and data integrity.
  • Pipelined burst: Pipelined burst mode allows for continuous data transfer with minimal latency.
  • On-chip DLL: Integrated DLL provides clock alignment and skew compensation for reliable operation at high frequencies.
  • Separate read and write ports: Dual ports allow simultaneous read and write operations, maximizing bandwidth.
  • 1.8V power supply: Low voltage operation reduces power consumption and simplifies system design.

Benefits

  • Increased system throughput: High bandwidth enables faster data processing and improved system throughput.
  • Reduced latency: Pipelined burst mode minimizes latency, improving real-time performance.
  • Enhanced signal integrity: On-chip DLL ensures reliable operation at high frequencies.
  • Lower power consumption: Low voltage operation reduces power consumption and extends battery life.
  • Simplified system design: Integrated features simplify system design and reduce component count.

Technical Specifications

The CY7C1320AV18-167BZC operates from a 1.8V power supply. It is available in a BGA package. The operating temperature range is typically 0°C to +70°C. The memory density is typically 18Mb. It requires a stable and clean power supply for optimal performance.

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