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CY7C1049DV3310ZXC

Part No CY7C1049DV3310ZXC
Manufacturer Cypress Semiconductor Corp
Catalog OEM Parts (C - E)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 1054207-CY7C1049DV3310ZXC
Categories OEM Parts(C-E)
Manufacturer Cypress Semiconductor Corp
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian CY7C1049DV3310ZXC CAD Model

Description

The CY7C1049DV33-10ZXC is a high-performance CMOS Static RAM (SRAM) device with a capacity of 512K x 8 bits. It is engineered for applications requiring rapid data access and minimal power usage, rendering it appropriate for diverse memory applications in embedded systems, networking, and data processing.

Applications:

  • Embedded Systems
  • Networking Equipment
  • Data Processing Systems
  • Cache Memory
  • Buffer Memory

Features:

  • High-speed access time: 10 ns
  • Low active power consumption
  • Low standby power consumption
  • TTL-compatible inputs and outputs
  • Single 3.3V power supply
  • 512K x 8 bit organization

Benefits:

  • Expedited data access enhancing system performance.
  • Diminished power consumption prolonging battery life in portable contexts.
  • Streamlined integration with standard TTL logic.
  • Extensive operating voltage scope providing design adaptability.
  • Elevated reliability warranting sustained system steadiness.

Additional Details:

The CY7C1049DV33-10ZXC is powered by a single 3.3V supply and boasts fully static operation, negating the necessity for clocks or refresh cycles. Its TTL-compatible inputs and outputs permit facile integration with a broad spectrum of microprocessors and microcontrollers. The device's low power demand is a result of CMOS technology, establishing it as a superb selection for energy-efficient endeavors. It finds prevalent utilization in domains where swiftness and low power usage are critical criteria. The SRAM is obtainable in an assortment of package alternatives to accommodate varying board arrangements and assembly methodologies.

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