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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Base Product Number XCZU6
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1029769-XCZU6EG-2FFVB1156I
Ultra Librarian 3D Model Ultra Librarian XCZU6EG-2FFVB1156I CAD Model

Description

The XA6SLX9-2CSG324I is an automotive, AEC-Q100, Spartan-6 LX XA FPGA that comes in a tray package.

  • Features: Automotive, AEC-Q100
  • Series: Spartan-6 LX XA
  • Package: Tray
  • I/O: 200
  • LABs/CLBs: 715
  • Logic Elements/Cells: 9152
  • Voltage Supply: 1.14V to 1.26V
  • Total RAM: 589824 bits
  • Application: Embedded FPGAs
  • Temperature Range: -40°C to 100°C (TJ)
  • Package/Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
  • Alternative Parts (Cross-Reference): XC6SLX9-2CSG324C, XC6SLX92CSG324I, XC6SLX93CSG324C, EP3C10F256C7N, EP4CE10F17C8N, LCMXO3LF-6900C-6BG324C
  • MSL Level: 3 (168 hours)
  • REACH Status: REACH unaffected
  • HTSUS: 8542.39.0001
  • Base Product Number: XA6SLX9

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