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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Base Product Number XCZU6
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1204402-XCZU6EG-2FFVB1156E
Ultra Librarian 3D Model Ultra Librarian XCZU6EG-2FFVB1156E CAD Model

Description

The Zynq® UltraScale+™ MPSoC EG is a powerful and versatile system on chip (SoC) that features a quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex®-R5 with CoreSight™, and ARM Mali™-400 MP2 core processors.

  • Speed Range: 533MHz to 1.3GHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • RAM: 256KB
  • Architecture: MCU/FPGA
  • Package: 1156-BBGA, FCBGA
  • Temperature Range: 0°C to 100°C

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