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Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU5
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Win Source Part Number 1353769-XCZU5EG-3FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU5EG-3FBVB900E CAD Model

Description

The XCZU5EG-3FBVB900E is a powerful system-on-chip (SoC) integrated circuit from the Zynq® UltraScale+™ MPSoC EG series by AMD.

  • Temperature Range: 0°C to 100°C
  • Package: Tray
  • Supplier Device Package: 900-FCBGA (31x31)
  • Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5 with CoreSight™
  • Connectivity Options: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Logic Cells: 256K+
  • RAM: 256KB

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