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Same model may have multiple batches, images only for reference.
XC7Z035-1FFG676C Real Image
Same model may have multiple batches, images only for reference.

XC7Z035-1FFG676C

Part No XC7Z035-1FFG676C
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA / Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 275K Logic Cells 667MHz 676-FCBGA (27x27)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z035
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 999413-XC7Z035-1FFG676C
Ultra Librarian 3D Model Ultra Librarian XC7Z035-1FFG676C CAD Model

Description

The XC7Z035-1FFG676C is a system on chip (SoC) from the Zynq-7000 series by AMD Xilinx.

  • Processor: dual ARM Cortex-A9 MPCore processor with CoreSight
  • Speed: 667MHz
  • Logic Cells: 275K
  • RAM Size: 256KB
  • Package: 676-BBGA, FCBGA
  • I/Os: 130
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • MSL: level 4 (72 hours)
  • REACH: unaffected
  • HTSUS: 8542.39.0001
  • RoHS: non-compliant

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1+ $119.1418 $119.1418
2+ $115.2986 $230.5972
3+ $111.4553 $334.3659
4+ $99.9254 $399.7016
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