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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU5
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1033455-XCZU5EG-2FBVB900I
Ultra Librarian 3D Model Ultra Librarian XCZU5EG-2FBVB900I CAD Model

Description

The XCZU5EG-2FBVB900I is a Zynq® UltraScale+™ MPSoC EG FPGA from AMD Xilinx.

  • Package: 900-BBGA, FCBGA
  • Logic Cells: 256K+
  • I/Os: 204
  • RAM Size: 256KB
  • Voltage Supply: 0.825V to 0.876V
  • Temperature Range: -40°C to 100°C
  • Application: suitable for use in a wide range of applications, including automotive, industrial, and telecommunications.

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