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Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU5
Standard Package 1
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Win Source Part Number 1351102-XCZU5EG-1FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU5EG-1FBVB900E CAD Model

Description

The XCZU5EG-1FBVB900E is an integrated circuit (IC) from the Zynq® UltraScale+™ MPSoC EG series.

  • Series: Zynq® UltraScale+™ MPSoC EG
  • Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 core processor
  • Speeds: 500MHz, 600MHz, and 1.2GHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/Os: 204
  • RAM Size: 256KB
  • FPGA: Zynq® UltraScale+™ FPGA with 256K+ logic cells
  • Package/Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31).39.0001
  • Manufacturer: AMD

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Quantity Unit Price Ext. Price
1+ $590.8405 $590.8405
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Availability: 714 pieces
Order Increment : 1 piece
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