XCZU4EV-1SFVC784E Real Image
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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EV
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 784-BFBGA, FCBGA
Supplier Device Package 784-FCBGA (23x23)
Number of I/O 252
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Other Names 122-2269,XCZU4EV-1SFVC784E-ND
Standard Package 1
Win Source Part Number 1193458-XCZU4EV-1SFVC784E
Ultra Librarian 3D Model Ultra Librarian XCZU4EV-1SFVC784E CAD Model

Description

The XCZU4EV-1SFVC784E is a Zynq UltraScale+ MPSoC EV series integrated circuit manufactured by AMD Xilinx. It is an embedded system on chip (SoC) with a quad-core ARM Cortex-A53 MPCore processor with CoreSight, dual-core ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2.

  • Series: Zynq UltraScale+ MPSoC EV
  • Processor: Quad-Core ARM Cortex-A53 MPCore with CoreSight, Dual-Core ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2
  • Speed: 500MHz, 600MHz, 1.2GHz
  • RAM Size: 256KB
  • FPGA Logic Cells: 192K+
  • I/O: 252
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA, WDT
  • Operating Temperature: 0°C to 100°C (TJ)
  • Package: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
  • REACH Status: Unaffected
  • HTSUS: 8542.39.0001

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Quantity Unit Price Ext. Price
1+ $143.3600 $143.3600
2+ $137.9706 $275.9412
3+ $132.5811 $397.7433
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Availability: 1,200 pieces
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