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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1192776-XCZU4CG-2FBVB900I
Ultra Librarian 3D Model Ultra Librarian XCZU4CG-2FBVB900I CAD Model

Description

The AMD Xilinx Zynq® UltraScale+™ MPSoC CG series system on chip (SoC) is a dual-core processor with a primary attribute of a Zynq® UltraScale+™ FPGA with 192K+ logic cells.

  • Series: Zynq® UltraScale+™ MPSoC CG
  • Primary Attribute: Zynq® UltraScale+™ FPGA with 192K+ logic cells
  • Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Speed: 533MHz, 1.3GHz
  • I/O: 204
  • RAM Size: 256KB
  • Operating Temperature: -40°C to 100°C (TJ)
  • AEC-Q200: Rated
  • Peripherals: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Features: DMA, WDT
  • Package Type: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $190.0000 $190.0000
2+ $182.4001 $364.8002
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Availability: 1,020 pieces
Order Increment : 1 piece
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