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Same model may have multiple batches, images only for reference.
XCZU4CG-2FBVB900E Real Image
Same model may have multiple batches, images only for reference.

XCZU4CG-2FBVB900E

Part No XCZU4CG-2FBVB900E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A53 900FCBGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1197390-XCZU4CG-2FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU4CG-2FBVB900E CAD Model

Description

The AMD Xilinx XCZU4CG-2FBVB900E is an embedded system on chip that offers a high level of performance and flexibility.

  • Processors: Dual ARM Cortex-A53 MPCore, Dual ARM Cortex-R5 with CoreSight
  • Maximum Speed: 1.3GHz
  • Temperature Range: 0°C to 100°C
  • I/Os: 204
  • RAM Size: 256KB
  • Package: 900-BBGA, FCBGA
  • Manufacturer: AMD Xilinx

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2+ $250.2504 $500.5008
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