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Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 999253-XCZU4CG-1FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU4CG-1FBVB900E CAD Model

Description

The XCZU4CG-1FBVB900E is an integrated circuit that belongs to the Zynq UltraScale+ MPSoC CG series.

  • Cores: Dual-core ARM Cortex-A53 MPCore with CoreSight, dual-core ARM Cortex-R5 with CoreSight, Zynq UltraScale+ FPGA with 192K+ logic cells
  • Speed: 500MHz and 1.2GHz
  • Temperature Range: 0°C to 100°C
  • I/Os: 204
  • RAM: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA and WDT
  • Package: 900-BBGA, FCBGA
  • Manufacturer: AMD Xilinx

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1+ $218.0452 $218.0452
2+ $195.4888 $390.9776
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