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XCZU11EG-L1FFVC1760I

Part No XCZU11EG-L1FFVC1760I
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC SOC CORTEX-A53 1760FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 500MHz, 600MHz, 1.2GHz 1760-FCBGA (42.5x42.5)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Number of I/O 512
Base Product Number XCZU11
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1217644-XCZU11EG-L1FFVC1760I
Ultra Librarian 3D Model Ultra Librarian XCZU11EG-L1FFVC1760I CAD Model

Description

The XCZU11EG-L1FFVC1760I is an integrated circuit belonging to the category of embedded system on chip (SoC).

  • Manufacturer: It is manufactured by AMD Xilinx
  • Series: and is a part of the Zynq UltraScale+ MPSoC EG series.
  • Core: This IC has a quad ARM Cortex-A53 MPCore with CoreSight, dual ARM Cortex-R5 with CoreSight, and ARM Mali-400 MP2.
  • Speed: It has a speed of 500MHz, 600MHz, and 1.2GHz.
  • Package: It has a package of tray and a standard package of 1.
  • Connectivity: It has various connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
  • Peripherals: It has peripherals such as DMA and WDT.
  • RAM Size: It has a RAM size of 256KB
  • Flash Size: and flash size of -.
  • Architecture: It has a unique architecture of MCU and FPGA
  • Attributes: and its primary attributes are Zynq UltraScale+ FPGA, 653K+ logic cells.
  • Package/Case: It has a package/case of 1760-BBGA, FCBGA
  • Supplier Device Package: and a supplier device package of 1760-FCBGA (42.5x42.5).
  • Operating Temperature: It has an operating temperature range of -40°C to 100°C (TJ)
  • ECCN: and is ECCN: 5A002A4 XIL.
  • REACH: It is REACH unaffected
  • HTSUS: and has an HTSUS of 8542.39.0001.

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