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XCVU095-2FFVB1760E

Part No XCVU095-2FFVB1760E
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 702 I/O 1760FCBGA / series Field Programmable Gate Array (FPGA) IC 702 62259200 1176000 1760-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Virtex® UltraScale™
Package Bulk
Number of LABs/CLBs 67200
Number of Logic Elements/Cells 1176000
Total RAM Bits 62259200
Number of I/O 702
Voltage - Supply 0.922V ~ 0.979V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Base Product Number XCVU095
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7B
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1010824-XCVU095-2FFVB1760E
Ultra Librarian 3D Model Ultra Librarian XCVU095-2FFVB1760E CAD Model

Description

The XCVU095-2FFVB1760E is a high-performance Virtex UltraScale FPGA (Field-Programmable Gate Array) from AMD (formerly Xilinx). This FPGA is designed for demanding applications requiring high logic density, high-speed connectivity, and advanced signal processing capabilities.

Applications

  • Data Center Acceleration
  • Networking and Communications Infrastructure
  • Aerospace and Defense
  • High-Performance Computing (HPC)
  • Video Processing
  • Medical Imaging

Features

  • Logic Cells: High density of logic cells enables complex designs.
  • Flip-Flops: Large number of flip-flops for sequential logic implementation.
  • Block RAM: On-chip Block RAM for high-speed data storage.
  • DSP Slices: Dedicated DSP slices for signal processing functions.
  • High-Speed Transceivers: Supports various high-speed communication protocols (e.g., PCIe, Ethernet).
  • I/O Pins: Large number of programmable I/O pins for interfacing with external devices.
  • Package: FFVB1760 package with 1760 pins.
  • Speed Grade: -2 speed grade indicating a specific performance level.

Benefits

  • High Performance: Enables the implementation of complex and high-speed applications.
  • Flexibility: Programmable logic allows for customization and adaptation to specific requirements.
  • Integration: Integrates various functions into a single device, reducing system complexity.
  • Scalability: Can be scaled to meet different performance and resource requirements.
  • Time-to-Market: Reduces time-to-market by enabling rapid prototyping and development.
  • Power Efficiency: Optimized for power efficiency in high-performance applications.

Additional Details

The XCVU095-2FFVB1760E requires specialized software tools for design, simulation, and implementation. These tools allow developers to create and verify their designs before programming the FPGA. Detailed specifications regarding power consumption, timing characteristics, and supported communication protocols can be found in the AMD/Xilinx documentation for the Virtex UltraScale family. Proper thermal management is crucial for reliable operation due to the high power dissipation of the FPGA.

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