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XCVC1902-1LSEVSVA2197

Part No XCVC1902-1LSEVSVA2197
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC VERSAL AICORE FPGA 2197BGA / Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1.9M Logic Cells 400MHz, 1GHz 2197-FCBGA (45x45)
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)
Number of I/O 770
MSL Level 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Win Source Part Number 1354825-XCVC1902-1LSEVSVA2197
Ultra Librarian 3D Model Ultra Librarian XCVC1902-1LSEVSVA2197 CAD Model

Description

The XCVC1902-1LSEVSVA2197 is an embedded system on chip (SoC) from AMD.

  • Series: Versal™ AI Core
  • Temperature Range: 0°C to 100°C
  • Speed: 400MHz to 1GHz
  • Processor: Dual ARM® Cortex®-A72 MPCore™ processor with CoreSight™ and dual ARM® Cortex®-R5F with CoreSight™
  • I/Os: 770
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, and USB OTG
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, and PCIe
  • Suitable for: AI applications that require high-performance processing and connectivity capabilities.

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