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Same model may have multiple batches, images only for reference.
XCZU5CG-2FBVB900E Amd
Same model may have multiple batches, images only for reference.

XCZU5CG-2FBVB900E

Part No XCZU5CG-2FBVB900E
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr AMD
Series Zynq® UltraScale+™ MPSoC CG
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU5
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Win Source Part Number 1353751-XCZU5CG-2FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU5CG-2FBVB900E CAD Model

Description

The AMD Zynq UltraScale+ MPSoC CG is an embedded system-on-chip (SoC) that offers a high level of integration and performance.

  • Series: Zynq UltraScale+ MPSoC CG
  • Manufacturer: AMD
  • Operating Temperature: 0°C ~ 100°C
  • Product Status: Active
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
  • Base Product Number: XCZU5
  • Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight + Dual ARM Cortex-R5 with CoreSight
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Description: An ideal choice for applications that require a powerful and highly integrated system-on-chip solution.

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