XC7Z045-3FBG676E Real Image
Same model may have multiple batches, images only for reference.

Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1GHz
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z045
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1105706-XC7Z045-3FBG676E
Ultra Librarian 3D Model Ultra Librarian XC7Z045-3FBG676E CAD Model

Description

The XC7Z045-3FBG676E is a Kintex-7 FPGA integrated circuit with 350K logic cells by AMD Xilinx.

  • Processor: Dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Processor Speed: 1GHz
  • Package: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
  • Temperature Range: 0°C to 100°C (TJ)
  • REACH: Unaffected
  • Peripherals: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • DMA: Yes
  • I/O: 130
  • RAM Size: 256KB
  • Flash Size: Not specified

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