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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 1GHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Package / Case 484-BBGA, FCBGA
Supplier Device Package 484-FCBGA (23x23)
Number of I/O 130
Base Product Number XC7Z030
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-1887
Standard Package 1
Win Source Part Number 1006511-XC7Z030-3FBG484E
Ultra Librarian 3D Model Ultra Librarian XC7Z030-3FBG484E CAD Model

Description

The XC7Z030-3FBG484E is an integrated circuit designed by AMD Xilinx.

  • Series: Zynq-7000
  • Core Processor: Dual ARM Cortex-A9 MPCore™ with CoreSight™
  • Speed: 1GHz
  • Package: Tray
  • RoHS: Non-compliant
  • Supply/Demand: Limited
  • Application: Embedded - System on Chip (SoC)
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA
  • I/O: 130
  • RAM Size: 256KB
  • Architecture: MCU, FPGA
  • Primary Attributes: Kintex-7 FPGA, 125K Logic Cells
  • Package/Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • ECCN: 3A991D
  • MSL Level: 3 (168 Hours)
  • REACH Status: REACH Unaffected
  • HTSUS: 8542.39.0001

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Quantity Unit Price Ext. Price
1+ $138.9474 $138.9474
2+ $134.3158 $268.6316
3+ $120.4211 $361.2633
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Availability: 900 pieces
Order Increment : 1 piece
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