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Same model may have multiple batches, images only for reference.
XC7Z007S-2CLG400I Real Image
Same model may have multiple batches, images only for reference.

XC7Z007S-2CLG400I

Part No XC7Z007S-2CLG400I
Manufacturer Amd
Catalog Embedded - System On Chip (SoC)
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Mfr AMD Xilinx
Series Zynq®-7000
Package Tray
Architecture MCU, FPGA
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 766MHz
Primary Attributes Artix™-7 FPGA, 23K Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 400-LFBGA, CSPBGA
Supplier Device Package 400-CSPBGA (17x17)
Number of I/O 100
Base Product Number XC7Z007
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-1999
Standard Package 90
Win Source Part Number 1316335-XC7Z007S-2CLG400I
Ultra Librarian 3D Model Ultra Librarian XC7Z007S-2CLG400I CAD Model

Description

The XC7Z007S-2CLG400I is a Zynq-7000 series System on Chip (SoC) from AMD Xilinx.

  • Core Processor: Single ARM Cortex-A9 MPCore with CoreSight
  • Operating Speed: 766MHz
  • Package: 400-LFBGA, CSPBGA
  • Logic Cells: 23K
  • RAM: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA
  • Number of I/Os: 100
  • Architecture: MCU and FPGA
  • ECCN: 3A991D
  • Operating Temperature: -40°C to 100°C
  • Application: Embedded Systems

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