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XC7VX330T-2FFV1761C

Part No XC7VX330T-2FFV1761C
Manufacturer Amd
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 700 I/O 1760FCBGA / series Field Programmable Gate Array (FPGA) IC 700 27648000 326400 1760-BBGA, FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Series Virtex®-7 XT
Package Bulk
Product Status Obsolete
Number of LABs/CLBs 25500
Number of Logic Elements/Cells 326400
Total RAM Bits 27648000
Number of I/O 700
Voltage - Supply 0.97V ~ 1.03V
Mounting SMD (SMT)
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1761-FCBGA (42.5x42.5)
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1029083-XC7VX330T-2FFV1761C
Ultra Librarian 3D Model Ultra Librarian XC7VX330T-2FFV1761C CAD Model

Description

The XC7VX330T-2FFV1761C is a Virtex-7 FPGA from AMD (formerly Xilinx). The Virtex-7 family is known for its high performance and high capacity, making it suitable for a wide range of demanding applications. The '330T' indicates a device with approximately 330,000 logic cells. The '-2' denotes the speed grade, and 'FFV1761C' specifies the package type (Fine-Pitch Flip-Chip, 1761 balls) and temperature grade (Commercial).

Applications

  • High-Performance Computing: Used in data centers and supercomputers for accelerating computationally intensive tasks.
  • Networking: Employed in routers, switches, and other networking equipment for packet processing and traffic management.
  • Wireless Communications: Used in base stations and other wireless infrastructure for signal processing and modulation.
  • Aerospace and Defense: Utilized in radar systems, electronic warfare systems, and other high-reliability applications.
  • Medical Imaging: Integrated into MRI, CT, and other medical imaging equipment for image processing.

Features

  • Kintex-7 Architecture: Based on Xilinx's 28nm Kintex-7 FPGA architecture.
  • Configurable Logic Blocks (CLBs): Contains a large array of configurable logic blocks for implementing custom logic functions.
  • Block RAM: Includes substantial on-chip block RAM for data storage.
  • DSP Slices: Features dedicated DSP slices for high-performance signal processing.
  • High-Speed Transceivers: Equipped with high-speed serial transceivers for interfacing with external devices.
  • Integrated Memory Controllers: Includes integrated memory controllers for interfacing with DDR3 and other memory types.

Benefits

  • High Performance: Delivers exceptional performance for demanding applications.
  • High Capacity: Provides ample logic resources for complex designs.
  • Low Power Consumption: Optimized for low power consumption, reducing system costs.
  • Flexible Architecture: Can be configured to implement a wide range of functions.
  • Advanced Features: Includes advanced features such as high-speed transceivers and integrated memory controllers.

Additional Details

The XC7VX330T-2FFV1761C is programmed using Xilinx's Vivado Design Suite. It supports a variety of industry-standard interfaces, including PCI Express, Ethernet, and Serial RapidIO. Refer to the Xilinx datasheet for detailed specifications on power consumption, timing characteristics, and configuration procedures.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $315.5328 $315.5328
2+ $282.8914 $565.7828
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